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Formation of microstructural via as an application of masking tape |
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Item |
Unit |
#3250A |
#3600K |
|---|---|---|---|
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Thickness of substrate |
um |
12 |
12 |
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Thickness of adhesive |
um |
2 |
4 |
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Material of release liner |
- |
PE |
PET |
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Thickness of release liner |
um |
30 |
25 |
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Adhesion (stainless steel) |
N/25mm |
0.13 |
0.27 |
|
Light transmission |
% |
92.3 |
92.1 |
* The method for measuring adhesion complies with JIS Z0237.
* The above figures are only measurements; their values are not guaranteed.
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