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The tapes protect the surfaces of various LCD optical films, such as those for diffusion and brightness enhancement. Our products protect optical films in various scenes, including production, processing, and transportation

Double-faced adhesive tapes 3800 Series have been developed to attach the backlight and LCD modules .

 Clean film featuring thermal stability of its component polymer and little emission of outgassing component.

The 5200 series of the functional foam tape, consisting foam with a high degree of stress relaxation and an adhesives are design to absorb strong impact.

These series have no base material and only an adhesive layer,and highly transparent. A high- performance acrylic adhesive is used in the adhesive layer,which shows different features according to each series of tapes.

The polishing cloth setting double-faced tapes are widely used in electronic material manufacturing processes, including LCD glass substrate manufacturing processes.

Masking tape protect various substrates in the multilayer substrate manufacturing process. Their weak adhesion characteristic permits easy peeling and improved workability.

This sheet is constructed from a very thin polyester film that is uniformly coated with special transparent adhesive in a clean room and is particularly suitable for protection of photo-masked surfaces in the printed circuit board (PCB) manufacturing process.

157SD keeps the anti-adhesion layer intact, even under solvent attack, and allows you to easily peel off the mask, even against a liquid resist with strong tacking capability.

TACKWELL 157ASD is the tape with a highly durable and antistatic layer that newly added on the highly durable release layer of TACKWELL 157SD.   In addition, another new funcion -a bubble-suppressing funcion- is added to prevent bubbles from forming by lamination

 This is a tape for protection for the back of wafers in the UBM process. This tape generates gas by UV irradiation, which makes it possible for the tape to be easily removed from an adherend.

The STS Series has a ultra-thin design and provides electric conductivity and adhesion, which is suitable for granding and shielding thin devices.


This is a tape used in manufacturing component-embeded substrates,which can temporarily fix components at temperatures of up to 150 ℃ and be removed by UV irradiation. 




Butyral and PVC Resin

SEKISUI Fine Chemicals Division

LCD Dpacer, Microsphere and Photosensitive Resin

Micropearl SOL

Solder plated true sphere with a plastic core and was designed for mounting chips to circuit board.

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