Low Outgas Release Film

Features

Low Outgas Release Film
  • Clean film featuring thermal stability of its component polymer and little emission of outgassing component.
  • High mechanical strength including tensile force,breaking elongation,and tear strength and low directional property.
  • Low rate change in dimensions at high temperatures,excellent dimensional stability.

Characteristics

General physical properties

Thickness(μm) 50
Item Measured value Test method
Outgas amount(ppm) 250 Amount of volatille components emitted when heated at 170'C fot 10minutes(based on toluene convension)
Tensile strength[23'C](MPa) MD 51 JIS K7127
TD 53
Tensile elongation[23'C](%) MD 700 JIS K7127
TD 720
Tear strength[23'C](KN/m) MD 170 JIS K7128-3
TD 170
Dimension rate of change[170'C](%) MD -0.9 Heating time:30minutes Dimension rate of change=(dimension after heating-dimension before heating)/(dimension before heating)
TD -0.3
Melting point('C) 223 JIS K7121
Blocking force('C) 1.6 ASTM D1893
Density(g/cm3) 1.31  

*The above figures are only measurements,their values are not guaranteed.

Applications

  • Release film for printed-circuit board heat-press processes.
  • Release film for liquid-crystal glass laminating press processes.
■Low outgassing test Low outgassing test

Example of use

Example of use

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