High Adhesion-easy Removable UV Tape
SELFA series
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- High Adhesion-Easy Removable UV Tape SELFA Series
What is SELFA
SELFA Series are UV release tape that achieve strong adhesion and easy peeling.N2 Gas is generated between the tape and the adherend by UV irradiation, and it can be easily peeled off with No adhesion, making it possible to process thinly polished wafers without damage.We will propose the optimal grade from a wide lineup such as single-sided HS with high heat resistance, HW for Glass Carrier Support System, MP with excellent chemical resistance.
Features of SELFA Series
Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology
Enables implementation of
new processes such as reflow
Increases capability
for ultra-thin devices
Has wide
process window
Low Force Debond:
N2 Gas Release Enable Damage Free Debond
Enables Low Residue Debond even after Heat Processes
Conventional UV Tape | SELFA | |
---|---|---|
Heat Resistance | ×(Less than 150℃) | 220℃ @ 2hr + Reflow |
Residue | × | Residue Free |
Single Sided Heat Resistance SELFA:HS Series
For protecting devices from heat process during assembly and packaging
Feature
- High resistance to heat and chemicals
- Achieves both high adhesion and low residue
Application
Product Specifications
Grade | Type | Heat Resistance | Debonding Method | Base Film | Adhesive for Device-side |
Adhesive for Support-side |
UV Wavelength (nm) |
UV Intensity (mj/cm2) |
Application |
---|---|---|---|---|---|---|---|---|---|
HS | Single | ○ | Peel | Heat Resistant Film | UV Curing | - | 405 | 3000 | Reflow |
Double Sided Heat Resistance SELFA:HW Series
Enable improvved productivity by utilizing tape type glass carrier support system
Feature
- Tape type adhesive supported glass carrier enable better handling capabilities
- N2 Gas release debonding mechanism results in damage free debonding
- High resistance to heat and chemicals
Application Example:Warpage control for Sensor Wafe
Product Specifications
Grade | Type | Heat Resistance | Debonding Method | Base Film | Adhesive for Device-side |
Adhesive for Support-side |
UV Wavelength (nm) |
UV Intensity (mj/cm2) |
Application |
---|---|---|---|---|---|---|---|---|---|
HW | Double | ○ | Peel N2 Gas release debond |
Heat Resistant Film | UV Curing | N2 Gas Release | 405 254 |
3000 12000 |
Glass Support |
Test Result
BG Test
Test Condition | Result |
---|---|
Wafer Thickness 700μm ⇒ 50~30μm |
Edge |
Chemical Resistance
3 Hours Dipping Test 【Glass + SELFA HW +Wafer】
Acid (SC2:HCl+H2O2+H20):3 Hours |
Base (2.38% TMAH):3 Hours |
|
---|---|---|
Without Pre-UV |
Edge NG |
Edge NG |
With Pre-UV |
Edge OK |
Edge OK |
Heat Resistivity
a) 220℃×2Hr | b) 260℃ Reflow | |
---|---|---|
Condition |
Hot Plate |
|
Structure 【Glass + SELFA HW + Wafer】 |
No Change:2 Hours OK |
No Change:3 Times OK |
Self-releasable Protective Tape in UBM Process SELFA-MP
This is a tape for protection for the back of wafers in the UBM process. This tape generates gas by UV irradiation, which makes it possible for the tape to be easily removed from an adherend.
Feature
- SELFA-MP has a UV self-releasing function that its adhesive strength goes down by UV irradiation, which enables the tape to be easily peeled off even after the plating process.
Application
Protection for the back of a wafer in the UBM process.
Application examples
- UBM process
- Pre-treatment (Alkali solutions at with a ph of 9)
- Post-treatment (Strong acids and strong alkali)
- Metal plating (Ni, Au and other metal)
Characteristics
General physical properties
Item | Unit | ||
---|---|---|---|
Thickness | base film | 25μm | |
adhesive | 30μm |
Item | Unit | SUS | Silicon wafer | Gold plating | |
---|---|---|---|---|---|
Adhesion | Before UV irradiation | N/25mm | 15.5 | 14.1 | 10.5 |
After UV irradiation | N/25mm | 0 | 0 | 0 |
- Adhesion: 180°peel testing at a speed of 300mm/min. UV irradiation 3000mJ/cm²
- The above figures are only measurements, their values are not guaranteed.
Wafer/Chip Manufacture Process Related Materila List
Material Category |
Product | Feature |
---|---|---|
Removable UV Tape | High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process [SELFA HS] |
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes. |
Removable UV Tape | Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems [SELFA HW] |
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling. |
Removable UV Tape | Self-releasable Protective Tape in UBM Process [SELFA-MP] |
UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling. |