UV Releasable Tape SELFA-SE

UV Releasable Tape SELFA-SE

This is a tape used in manufacturing component-embeded substrates,which can temporarily fix components at temperatures of up to 150 ℃ and be removed by UV irradiation.

Application

■Fixing of chips in a component-embedded substrate.

Fixing of chips in a component-embedded substrate

Characteristics

General physical properties

Item Unit
Thickness base film 50μm
adhesive 40μm
Item Unit 23℃ 150℃ for 20 min.
Adhesion* Before UV irrradiation N/25mm 4.0 17.0
After UV irradiation 0.05 0.30

*Adhesion: 180°peel testing at a speed of 300mm/min. UV irradiation 1000mJ
*The above figures are only measurements, their values are not guaranteed.

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