Low Outgas Release Film

Features

  • Clean film featuring thermal stability of its component polymer and little emission of outgassing component.
  • High mechanical strength including tensile force,breaking elongation,and tear strength and low directional property.
  • Low rate change in dimensions at high temperatures,excellent dimensional stability.
  • It follows patterns with high steps well and suppresses glue seepage during heat pressing.

Characteristics

  • Release film for heat press process of printed circuit board
  • Used to protect the surface during the heat pressing of the substrate and to prevent the adhesive of CVL from bleeding out
Applications

Applications

smart phone tablet
smart phone,tablet
automotive electronics
automotive electronics
game console
game console
HDD
HDD

Example of use

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