High Adhesion-easy Removable UV Tape
SELFA series

What is SELFA

SELFA Series are UV release tape that achieve strong adhesion and easy peeling.N2 Gas is generated between the tape and the adherend by UV irradiation, and it can be easily peeled off with No adhesion, making it possible to process thinly polished wafers without damage.We will propose the optimal grade from a wide lineup such as single-sided HS with high heat resistance, HW for Glass Carrier Support System, MP with excellent chemical resistance.

SELFAイメージ

Features of SELFA Series

Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology

Enables implementation of
new processes such as reflow

セルファシリーズ

Increases capability
for ultra-thin devices

Has wide
process window

耐熱性

Low Force Debond:
N2 Gas Release Enable Damage Free Debond

SELFAシリーズの特長イメージ
軽剥離,低残渣

Enables Low Residue Debond even after Heat Processes

Conventional UV Tape
Conventional UV Tape
SELFA
SELFA
Conventional UV Tape SELFA
Heat Resistance ×(Less than 150℃) 220℃ @ 2hr + Reflow
Residue × Residue Free

Single Sided Heat Resistance SELFA:HS Series

For protecting devices from heat process during assembly and packaging

SELFA HS

Feature

  • High resistance to heat and chemicals
  • Achieves both high adhesion and low residue

Application

SELFA HS 使用例
SELFA HS 使用例

Product Specifications

Grade Type Heat Resistance Debonding Method Base Film Adhesive
for Device-side
Adhesive
for Support-side
UV Wavelength
(nm)
UV Intensity
(mj/cm2)
Application
HS Single Peel Heat Resistant Film UV Curing - 405 3000 Reflow

Double Sided Heat Resistance SELFA:HW Series

Enable improvved productivity by utilizing tape type glass carrier support system

SELFA HW

Feature

  • Tape type adhesive supported glass carrier enable better handling capabilities
  • N2 Gas release debonding mechanism results in damage free debonding
  • High resistance to heat and chemicals

Application Example:Warpage control for Sensor Wafe

SELFA HW Application Example
SELFA HW Application Example
SELFA HW Application Example
SELFA HW Application Example

Product Specifications

Grade Type Heat Resistance Debonding Method Base Film Adhesive
for Device-side
Adhesive
for Support-side
UV Wavelength
(nm)
UV Intensity
(mj/cm2)
Application
HW Double Peel
N2 Gas release debond
Heat Resistant Film UV Curing N2 Gas Release 405
254
3000
12000
Glass Support

Test Result

BG Test

Test Condition Result
Wafer Thickness
700μm ⇒ 50~30μm

Edge

BGテスト結果

Chemical Resistance

3 Hours Dipping Test 【Glass + SELFA HW +Wafer】

Acid
(SC2:HCl+H2O2+H20):3 Hours
Base
(2.38% TMAH):3 Hours
Without
Pre-UV
Acid Pre-UV無し イメージ

Edge NG

Acid Pre-UV無し イメージ2
Base Pre-UV無し イメージ

Edge NG

Base Pre-UV無し イメージ2
With
Pre-UV
Acid Pre-UV有り イメージ

Edge OK

Acid Pre-UV有り イメージ2
Base Pre-UV有り イメージ

Edge OK

Base Pre-UV有り イメージ2

Heat Resistivity

a) 220℃×2Hr b) 260℃ Reflow
Condition

Hot Plate

耐熱性テスト ホットプレート 耐熱性テスト 220℃×2時間グラフ
耐熱性テスト 260℃リフローグラフ
Structure
【Glass + SELFA HW + Wafer】
220℃×2時間 実施後

No Change:2 Hours OK

260℃リフロー 実施後

No Change:3 Times OK

Self-releasable Protective Tape in UBM Process SELFA-MP

This is a tape for protection for the back of wafers in the UBM process. This tape generates gas by UV irradiation, which makes it possible for the tape to be easily removed from an adherend.

SELFA MP

Feature

  • SELFA-MP has a UV self-releasing function that its adhesive strength goes down by UV irradiation, which enables the tape to be easily peeled off even after the plating process.
SELFA MP 特長

Application

Protection for the back of a wafer in the UBM process.

SELFA MP 用途
SELFA MP 用途

Application examples

  • UBM process
  • Pre-treatment (Alkali solutions at with a ph of 9)
  • Post-treatment (Strong acids and strong alkali)
  • Metal plating (Ni, Au and other metal)

Characteristics

General physical properties

Item Unit
Thickness base film 25μm
adhesive 30μm
Item Unit SUS Silicon wafer Gold plating
Adhesion Before UV irradiation N/25mm 15.5 14.1 10.5
After UV irradiation N/25mm 0 0 0
  • Adhesion: 180°peel testing at a speed of 300mm/min. UV irradiation 3000mJ/cm²
  • The above figures are only measurements, their values are not guaranteed.

Wafer/Chip Manufacture Process Related Materila List

Material
Category
Product Feature
Removable UV Tape High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process
[SELFA HS]
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes.
Removable UV Tape Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems
[SELFA HW]
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling.
Removable UV Tape Self-releasable Protective Tape in UBM Process
[SELFA-MP]
UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling.